论文标题
RF属性及其在3D打印的Klystron电路中的变化
RF Properties and Their Variations in a 3D Printed Klystron Circuit and Cavities
论文作者
论文摘要
目前，像克莱斯特龙（Klystrons）这样的主动RF设备的制造是由昂贵且耗时的加工和铜制循环主导的。在本文中，我们表征了X波段klystron腔的RF性能和具有新型增材制造工艺制造的集成电路。零件在316升不锈钢中打印3D，并带有直接金属激光烧结，用铜电镀，并在一个简单的狂热周期中腌制。在整个制造过程中测量了独立的测试腔和集成电路腔。未调节的腔频率的变化少于预期频率的5％，而Q因子达到1200以上。进行了调整研究，未优化的调谐引脚达到了138 MHz的调谐范围为138 MHz，而不会损害Q。Klystron系统性能通过AS-Built构建的空腔参数和现实的调谐模拟。这些结果一起表明，此过程可以用来廉价，快速生产新一代高度集成的高功效设备。
Presently, the manufacturing of active RF devices like klystrons is dominated by expensive and time consuming cycles of machining and brazing. In this article we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts are 3D printed in 316L stainless steel with direct metal laser sintering, electroplated in copper, and brazed in one simple braze cycle. Standalone test cavities and integrated circuit cavities were measured throughout the manufacturing process. Un-tuned cavity frequency varies by less than 5% of intended frequency, and Q factors reach above 1200. A tuning study was performed, and unoptimized tuning pins achieved a tuning range of 138 MHz without compromising Q. Klystron system performance was simulated with as-built cavity parameters and realistic tuning. Together, these results show promise that this process can be used to cheaply and quickly manufacture a new generation of highly integrated high power vacuum devices.
