论文标题
雷耶（Reye）在纳米级服装中的理论分解
Breakdown of Reye's theory in nanoscale wear
论文作者
论文摘要
以类似于延性裂缝力学的类比，我们量化了在粘合剂磨损期间产生的碎屑颗粒的大小。较早的工作表明，假设碎屑尺寸与微接触尺寸成正比乘以连接剪切强度成正比，则暗示了切向工作与磨损碎片量之间的线性关系。但是，本研究揭示了与线性的偏差。这些偏差可以通过断裂力学合理化，这意味着产生碎屑所需的工作要小于所假定的碎屑。在这里，我们假设脱离磨损颗粒所需的工作是由花费的表面能制成的，以创建新的断裂表面，以及在裂缝周围给定宽度的骨折过程区内的塑料工作。通过分子动力学模拟验证的我们的理论模型揭示了碎片量（$ v_d $）与切向工作（$ W_T $）之间的超线性缩放关系：$ v_d \ sim w_t^{3/2} $ 3D和$ v_d and $ v_d \ sim w_t w_t^{2} $ in 2d in 2d in 2d。这项研究提供了一个理论基础，以估计由于粘合剂磨损过程而发出的细颗粒大小的统计分布。
Building on an analogy to ductile fracture mechanics, we quantify the size of debris particles created during adhesive wear. Earlier work suggested a linear relation between tangential work and wear debris volume, assuming that the debris size is proportional to the micro contact size multiplied by the junction shear strength. However, the present study reveals deviations from linearity. These deviations can be rationalized with fracture mechanics and imply that less work is necessary to generate debris than what was assumed. Here, we postulate that the work needed to detach a wear particle is made of the surface energy expended to create new fracture surfaces, and also of plastic work within a fracture process zone of a given width around the cracks. Our theoretical model, validated by molecular dynamics simulations, reveals a super-linear scaling relation between debris volume ($V_d$) and tangential work ($W_t$): $V_d \sim W_t^{3/2}$ in 3D and $V_d \sim W_t^{2}$ in 2D. This study provides a theoretical foundation to estimate the statistical distribution of sizes of fine particles emitted due to adhesive wear processes.
