论文标题
基于黄金（i）的化合物的解离电子附件：4,5-二氯1,3-二甲基咪唑基三氟甲基金（I）
Dissociative electron attachment to gold(i) based compounds: 4,5-dichloro 1,3-diethyl imidazolylidene trifluoromethyl gold(i)
论文作者
论文摘要
通过使用质子-NMR和粉末XRD（XRPD）研究，已经研究了特定Au Febid前体的适用性，以对低电子能量，结构，激发态和共振，结构晶体修饰，柔韧性和蒸发水平。 Uniquely designed precursor to meet the needs of focused electron beam induced deposition (FEBID) at the nanostructure level, the 4,5-dichloro 1,3-diethyl imidazolylidene trifluoromethyl gold(i) is a compound that proves its capability to create high purity structures, and its growing importance between other AuImx and AuClnB (where x, n are the number of radicals, B =放射癌治疗中的CH，CH3或BR）化合物增加了在SEM沉积和气相研究过程中设计更合适的键的努力。基于COKα线的XRPD XPERT3松利衍射仪对其粉末形状进行的研究显示，其结构随温度，真空水平和光的水平而变化。这种化合物的敏感性使得对辐射研究特别有趣。通过较小的C，H和O原子的含量较低，在结构和表面上使用的C污染水平较低，但是它用C-CL和C-N键代替这些键，而C-CL和C-N键在沉积过程中仍需要较低的键断裂能量，但仍需要额外的纯化步骤，无论是H2O，O2还是H Jets。
With the use of proton-NMR and powder XRD (XRPD) studies, the suitability of specific Au FEBID precursors has been investigated to low electron energy, structure, excited states and resonances, structural crystal modifications, flexibility, and vaporization level. Uniquely designed precursor to meet the needs of focused electron beam induced deposition (FEBID) at the nanostructure level, the 4,5-dichloro 1,3-diethyl imidazolylidene trifluoromethyl gold(i) is a compound that proves its capability to create high purity structures, and its growing importance between other AuImx and AuClnB (where x, n are the number of radicals, B = CH, CH3 or Br) compounds in the radiation cancer therapy increases the efforts to design more suitable bonds in processes of SEM deposition and in gas-phase studies. The investigation done to its powder shape using the XRPD XPERT3 Panalytical diffractometer based on CoKα lines show changes to its structure with temperature, level of vacuum, and light; the sensitivity of this compound makes it highly interesting to radiation research in particular. Used for FEBID, through its smaller number of C, H, and O atoms has lower levels of C contamination in the structures and on the surface, but it replaces these bonds with C-Cl and C-N bonds that have a lower bond breaking energy but still needing an extra purification step in the deposition process, whether is H2O, O2 or H jets.
