论文标题
AL基质复合材料的原位机械测试,以研究多个长度尺度的压缩塑性和故障
In situ mechanical testing of an Al matrix composite to investigate compressive plasticity and failure on multiple length scales
论文作者
论文摘要
SIC颗粒增强的Al基质复合材料具有高强度,高磨损性和出色的高温性能,但也可以具有较低的可塑性和骨折韧性,从而限制了它们在结构应用中的使用。这项研究调查了这种复合材料在多个长度尺度上的可塑性和失败,从应变定位到复杂的微观结构到从基质中脱离单个微粒的剥离。三个含有不同复杂性和尺寸/体积分数的微观结构的显微镜支柱用于研究这些特征对变形的影响。对于矩阵,纳米级的Al晶粒内金属间沉淀有助于增强作用,并且Al晶界被证明是预防主要的剪切带的应变定位的有效障碍,因此是灾难性衰竭。当发生剪切定位时,如果将剪切带和界面对准,则SIC颗粒可以从基质中脱落。为了研究界面是否是灾难性失败期间的弱点,通过直接脱键测试,将许多SIC颗粒与基质分离,该测试产生的界面强度远高于表现出剪切定位和界面脱落的柱子的关键分辨剪切应力。因此,矩阵粒子界面被排除为可能的弱点,而剪切定位被确定为可以驱动后续界面剥离的机制。
SiC particle-reinforced Al matrix composites exhibit high strength, high wear resistance, and excellent high-temperature performance, but can also have low plasticity and fracture toughness, which limits their use in structural applications. This study investigates the plasticity and failure of such a composite on multiple length scales, from strain localization through a complex microstructure to the debonding of individual microparticles from the matrix. Three microscale pillars containing microstructures with different complexities and sizes/volume fraction of SiC particles were used to study the effect of these features on deformation. For the matrix, nanoscale intermetallic precipitates within the Al grains contribute most to the strengthening effect, and the Al grain boundaries are shown to be effective obstacles for preventing strain localization by dominant shear bands and, therefore, catastrophic failure. When shear localization occurs, SiC particles can then debond from the matrix if the shear band and interface are aligned. To investigate whether the interface is a weak point during catastrophic failure, a number of SiC particles were separated from the matrix with direct debonding tests, which yield an interface strength that is much higher than the critical resolved shear stress for a pillar exhibiting both shear localization and interface debonding. Therefore, the matrix-particle interface is ruled out as a possible weak point, and instead shear localization is identified as the mechanism that can drive subsequent interface debonding.