论文标题

芯片芯片协议调试的Silicon后痕量分析方法

A Post-Silicon Trace Analysis Approach for System-on-Chip Protocol Debug

论文作者

Cao, Yuting, Zheng, Hao, Ray, Sandip, Yang, Jin

论文摘要

从硅痕迹中重建系统级行为是芯片后芯片设计后验证后的关键问题。目前在该领域的工业实践主要是手册,这取决于建筑师,设计师和验证者的协作见解。本文提出了一种痕量分析方法,该方法利用了系统级协议的架构模型,以在存在模棱两可和嘈杂数据的情况下从部分观察到的硅痕迹重建设计行为。该方法的输出是对系统级协议抽象的系统内部执行的所有潜在解释的集合。为了支持痕量分析方法,还提出了一个由系统级协议引导的伴随痕迹信号选择框架,并讨论了其对分析方法的复杂性和准确性的影响。该方法和框架已经在实现一组通用工业系统级协议的多核系统原型上进行了评估。

Reconstructing system-level behavior from silicon traces is a critical problem in post-silicon validation of System-on-Chip designs. Current industrial practice in this area is primarily manual, depending on collaborative insights of the architects, designers, and validators. This paper presents a trace analysis approach that exploits architectural models of the system-level protocols to reconstruct design behavior from partially observed silicon traces in the presence of ambiguous and noisy data. The output of the approach is a set of all potential interpretations of a system's internal executions abstracted to the system-level protocols. To support the trace analysis approach, a companion trace signal selection framework guided by system-level protocols is also presented, and its impacts on the complexity and accuracy of the analysis approach are discussed. That approach and the framework have been evaluated on a multi-core system-on-chip prototype that implements a set of common industrial system-level protocols.

扫码加入交流群

加入微信交流群

微信交流群二维码

扫码加入学术交流群,获取更多资源