论文标题

介电/半导体界面掺杂以开发解决方案的高性能1 V抗极氧化物 - 氧化物 - 氧化抗极

Dielectric/semiconductor interfacial doping to develop solution processed high performance 1 V ambipolar oxide-transistor and its application as CMOS inverter

论文作者

Chourasia, Nitesh K., Sharma, Anand, Pal, Nila, Biring, Sajal, Pal, Bhola N.

论文摘要

SNO2薄膜晶体管(TFT)的介电/半导体界面的P型掺杂已被用来发展高载体迁移率平衡的平衡Ambipolagency Ampolar氧化物氧化物晶体管。为了引入这种界面掺杂,已经通过使用两个包含三价原子的离子传导氧化物介质来制造底部胶地顶触点TFT。这些离子传导电介质分别为lilno2和ligao2,包含移动li+离子。在离子电介质顶部的SNO2薄膜制造过程中,这些三价原子允许p倍形到界面SNO2层,以在TFT通道中引入孔传导。为了实现这种界面掺杂现象,在包含二价锌(Zn)原子的相同条件下,用li2zno2介电制造了参考TFT。我们的比较电数据表明,使用Lilno2和LiGAO2介电的TFT在本质上是双极性的,而Li2ZNO2介电的TFT是单极的N通道晶体管,它揭示了SNO2的界面掺杂。最有趣的是,通过使用LILNO2电介质,我们能够制造1.0 V平衡的双极型TFT,高电子和孔迁移率分别为7 cm2 V-1 S-1和8 CM2 V-1 S-1,开/关比> 102> 102,用于低电力CMOS INVERETER FAREVERETRATION。

p-type doping from the dielectric/semiconductor interface of a SnO2 thin film transistor (TFT) has been utilized to develop high carrier mobility balanced ambipolar oxide-transistor. To introduce this interfacial-doping, bottom-gate top-contact TFTs have been fabricated by using two different ion-conducting oxide dielectrics which contain trivalent atoms. These ion-conducting dielectrics are LilnO2 and LiGaO2 respectively, containing mobile Li+ ion. During SnO2 thin film fabrication on top of the ionic dielectric, those trivalent atoms allow p- doping to the interfacial SnO2 layer to introduce the hole conduction in channel of TFT. To realize this interfacial doping phenomena, a reference TFT has been fabricated with Li2ZnO2 dielectric under the same condition that contains divalent zinc (Zn) atom. Our comparative electrical data indicates that TFTs with LilnO2 and LiGaO2 dielectric are ambipolar in nature whereas, TFT with Li2ZnO2 dielectric is a unipolar n-channel transistor which reveals the interfacial doping of SnO2. Most interestingly, by using LilnO2 dielectric, we are capable to fabricated 1.0 V balanced ambipolar TFT with a high electron and hole mobility values of 7 cm2 V-1 s-1and 8 cm2 V-1 s-1 respectively with an on/off ratio >102 for both operations which has been utilized for low-voltage CMOS inverter fabrication.

扫码加入交流群

加入微信交流群

微信交流群二维码

扫码加入学术交流群,获取更多资源